Wet Method Machine of Development, Etching and Stripping
Single wafer process equipment performs chemical solution development of exposed resist film and etching with acid.
These equipment can be installed in touch panel production line.
Features and Intended Use
Corresponding to roll to roll films.
An example of specifications
|Target||Glass substrate for LCD|
|Size||370 x 400.470 t 0.4, 0.55, 0.7, 1.1|
|Body size||Depth (length in the direction of travel) x Width x Height (with division)|
|-||Approximately 7,530 [mm] x 1,400 [mm] x FL + 1,650 [mm] (not including protrusions)|
|Body weight||Approximately 4,000 kg (dry weight)|
|Transfer method||Horizontal single wafer transfer method|
* Specifications are different depend on the substrate size. Please feel free contact us for the details.